According to industry sources cited by Digitimes, TSMC has started producing 3nm chips for Intel's next series of customers, codenamed Lunar Lake. This product is scheduled for an official launch next quarter, although Intel has not yet specified an exact date. It marks Intel's first use of TSMC nodes for all three chiplets in its disaggregated design, which includes the CPU tile and the SoC tile with GPU. The Lunar Lake chips use TSMC's N3B and N6 nodes.
Intel's Lunar Lake is anticipated to debut as the Core Ultra 200V series and will be the first to feature Lion Cove P-Cores and Skymont E-Cores. These architectures will also be used in the Core Ultra 200 “Arrow Lake-S” for desktop computers, which is expected to launch in the fourth quarter. The main differences between the two, aside from their platform and power targets, lie in their graphics capabilities.
Intel's Lunar Lake includes Xe2-LPG graphics, a low-power version of the Battlemage architecture, while Arrow Lake will feature Xe-LPG (Alchemist) graphics, similar to those in the Core Ultra 100 “Meteor Lake.” Another key difference is that Lunar Lake uses on-package (MoP) system memory. At Computex, Intel announced that Lunar Lake will launch in the third quarter, although a specific month was not revealed. This new architecture will be part of the Microsoft Copilot+PC platform once certified.
Through Wccftech
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